₹17,900.00 ( Incl. GST )
With its versatile and modern 64-bit, quad-core ARM-based processor — the Rockchip RK3568 — ASUS IoT Tinker Board 3N offers superior performance in NUC size. Powered by an ARM-based Mali™-G52 GPU, Tinker Board 3N offers smoother graphics processing and better data security, allowing for a wide range of applications in smart manufacturing and smart retail such as IoT gateways, human-machine interfacing (HMI), digital signage, self-service kiosk and more.
One of the key advantages of the Tinker Board 3N is its advanced memory configuration to better fulfill diversified market requirement. Featuring LPDDR4X memory, the board offers better data-transfer rates and operates with just 55% of the energy required by LPDDR4, while also boasting 5X-lower power consumption in standby mode compared to DDR4.
Tinker Board 3N features an advanced thermal design including a low-profile pushpin heatsink and SoC placement on the back side for added strength and ease of installation, with its diminutive NUC-scale dimensions allowing for SWaP-constrained space deployment and flexible system integration.. With reduced thermal throttling, developers can push the limits of performance without compromising stability. It is also engineered to operate smoothly in harsh industrial environments, with an impressive operating-temperature range of -40 to 85°C — making it ideal for everything from outdoor use to hectic factory environments.
Tinker Board 3N offers versatile connectivity options, ensuring superior system expandability for a wide range of applications. With interfaces such as PoE, LVDS, eDP, COM and CAN bus, this versatile SBC provides ample opportunities for seamless integration into various industrial and automation systems. Whether it’s factory controllers, robotic arms or alarm settings, Tinker Board 3N is ready for the task at hand.
Tinker Board 3N is also engineered with M.2 E and M.2 B slots, allowing for the addition of Wi-Fi or 4G/5G expansion modules. These expansion slots enable seamless integration of connectivity options, expanding the board’s capabilities — and ensure seamless wireless and cloud connectivity, reducing latency for real-time applications in smart factories and other IoT environments. The embedded COM headers and CAN bus functionality further enhance the board’s versatility, enabling it to meet the demands of diverse applications.
AICC is a unified platform for managing and analyzing big data collected by IoT devices running different operating systems.
Tinker Board 3N supports firmware over-the-air (FOTA) roll-out, enabling embedded systems developers using the board to be updated remotely with the mainstream and latest Android and Linux* firmware, operating system and drivers.
*Support by 2023 Q4
| SoC | Rockchip RK3568 |
|---|---|
| CPU | Quad-core Arm® Cortex®-A55 |
| GPU | Arm® Mali™-G52 |
| Display | 1 x HDMI™ with CEC hardware ready 1 x LVDS (Dual-link) 1 x eDP |
| Memory Size | Dual-CH LPDDR4/LPDDR4X 2GB / 4GB / 8GB |
| Storage | none / 32GB / 64GB eMMC Micro SD(TF) card slot (push/pull) SPI Flash 16MB |
| M.2 E key 2230 |
1 x for Wi-Fi 5/6 & BT module (PCIe 2.0 x1, USB 2.0) |
| M.2 B key 3042/3052 with nano-SIM slot |
1 x for 4G/5G or SSD module (PCIe 3.0 x1, USB 3.0, USB 2.0, SIM) |
| SIM Slot | x1 |
| Audio | 1 x 3.5 Phone Jack (w/ Mic) 1 x Speaker Stereo Pin Header (4ohm, 3W each) 1 x HDMI audio |
| USB | 1 x USB 3.2 Gen1 Type-C® OTG port 2 x USB 3.2 Gen1 Type-A ports 2 x USB 2.0 Pin header |
| CAN Bus 2.0B FD | x1 Pin Header |
| COM 232 (with flow control) | x2 Pin Header |
| COM 232/422/485 | x1 Pin Header |
| Internal Headers | 1 x 40-pin LVDS + eDP connector 1 x 5V Panel Backlight & Control header 1 x IR Receiver header 1 x 14-pin GPIO headers includes: – 1 x GND – 1 x I2C bus – 1 up to 2 x UART – up to 1 x SPI bus (2 select) – up to 1 x SPDIF – up to 4 x PWM – 2 x ADC (8 bit) 1 x 2-pin Recovery header 1 x 4-pin Power-on & Reset header 1 x 3-pin Debug UART header 1 x 4-pin DC Fan header 1 x 2-pin RTC Battery header |
| Power Connector 12~24V |
1 x DC Barrel Power Input Jack (5.5/2.5 mm) 1 x 4-Pin Power In Header (also for POE module) |
| OS Support | Debian 11 / Android 12 |
| Dimension | 4 x 4 inches / 100 x 100 mm |
| Operation temperature | 0℃ ~ 60℃ |
| Non operation temperature | 0℃ ~ 60℃ |
| Non operation humidity | 10% ~ 85% (Non condensing) |
| Note | *Default for 1 x 802.11 a/b/g/n/ac wireless & BT 5.0 (2T2R) |
Tinker Board 3N
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